tt_dram_temperature_bottom_celsius

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Name

Prometheus Metric Name

tt_dram_temperature_bottom_celsius

Metric Path (tt-telemetry)

Schema:

{hostname}/tray{tray}/chip{chip}/dram/module{module}/tt_dram_temperature_bottom_celsius

Example path:

bh-glx-c09u02/tray1/chip2/dram/module0/tt_dram_temperature_bottom_celsius

Description

The temperature of the bottom die of a GDDR (DRAM) module in degrees Celsius. Each chip has multiple DRAM modules, and each module has a top and bottom die with independent temperature sensors. This metric is only created if GDDR telemetry is available on the device.

Values

Type: Floating Point

Units: Degrees Celsius

Allowable values: A floating-point number representing the bottom die temperature. For example, 52.0 means the bottom die of the DRAM module is at 52 degrees Celsius.

Related Metrics

Metric	Description
tt_gddr_max_temperature_celsius	The maximum GDDR temperature observed across all modules on the chip.

Prometheus Labels

Label Name	Value
hostname	The host from which the metric was collected.
hall	The datacenter hall where the host is located. Sourced from the Factory System Descriptor (FSD).
aisle	The datacenter aisle where the host is located. Sourced from the Factory System Descriptor (FSD).
rack	The rack number where the host is located. Sourced from the Factory System Descriptor (FSD).
shelf_u	The shelf U position in the rack where the host is located. Sourced from the Factory System Descriptor (FSD).
tray	The tray (UBB) that the device is located on.
chip	The ASIC location within the tray.
module	The DRAM/GDDR module index on the chip.
unit	The unit of measurement. Always "°C" for this metric.